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| Sampe request: |
Single-seded:24hours
deuble-sided:7days
others:up to details |
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Immersion Tin PCB Minimum Annular Ring |
| Evergreen - MLPCB(21) Immersion Tin PCB Minimum Annular Ring of 0.076mm (3 mil) |
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| Key Specifications/Special Features: |
Multilayer PCBs
Number of layers: up to 12 layers
Major material: FR-4, CEM-3 (other materials upon request)
Minimum board thickness:
- Double side: 0.2mm (7.8 mil)
- 4 layer: 0.6mm (24 mil)
- 6 layer: 0.8mm (32 mil)
- 8-layer: 1.0mm (40 mil)
- 10-layer: 1.2mm (48 mil)
- 12-layer: 1.5mm (59 mil)
Maximum board thickness: 2.4mm (95 mil)
Surface finishing:
- Flash gold plating
- Immersion gold (max. 0.5 micrometer)
- Thick gold plating (max. 1.0 micrometer)
- Hot-air solder leveling
- Entek coating (OSP)
Solder mask: LPI (wet film), thermal cured type
Other print:
- Carbon print, peelable solder mask
- Solder mask plugged hole
Copper thickness (finishing): 1/2oz (18 micrometer) to 4oz (140 micrometer)
Minimum hole size: 0.3mm (12 mil)
Hold size tolerance (NPTH): +/- 0.076mm (3 mil)
Minimum line width and spacing: 0.1mm (4 mil)
Minimum solder mask clearance: 0.076mm (3 mil)
Minimum annular ring: 0.076mm (3 mil)
Profile and v-cut:
- V-cut, jump v-cut, CNC v-cut
- CNC-routing, stamping and beveling
Special process: blind/buried via hole |
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