Flexible PCB2

• Min. track width/spacing
  • Single-sided: 0.075mm (3 mils)
  • Double-sided: 0.100 mm (4 mils)
• Min. hold diameter
  • Drilling (P.T.H.): diameter 0.25mm
  • Punching: diameter 0.50mm
• Dimension tolerances
  • Conductor width: + / - 0.05mm
  • Hole diameter: + / - 0.05mm (with PTH + / - 0.10mm)
  • Accumulated pitch: + / - 0.05mm between conductors; + / - 0.10mm between holes
  • Outline dimension: + / - 0.10mm
  • Conductor and outline: + / - 0.15mm
• Insulation resistance: 1000mW (IPC-TM-650: 2, 6, 3, 2 at ambient)
• Dielectric strength: 5kV (IPC-TM-650 2.5.6.1)
• Surface resistance: 5 x 1012 (IPC-TM-650 2.5.6.17)
• Volume resistively: 1 x 1015 (IPC-TM-650 2.5.6.17)
• Dielectric constant (1 MHz): 4.0 (MIL-P-55617)
• Dissipation factor (1 MHz): 0.04 (MIL-P-55617)
• Peeling strength (180 degree direction): 1.0 kgf/cm (IPC-TM-650 2.4.9)
• Solder heat resistance: 300 degree C/10 seconds
• Flammability: 94 V-0 (UL94)
• Single-sided flex
  • Construction: coverlay film
    Material: polymide film
    Specifications: 13um, 25um, 50um, 75um
  • Construction: conductor
    Material: copper, RA, ED
    Specifications: 1/4oz, 1/3oz, 1/2oz, 1oz, 2oz, 3oz
  • Construction: substrate film
    Material: polymide film
    Specifications: 13um, 25um, 50um, 75um
• Double-sided flex
  • Construction: coverlay film
    Material: polymide film
    Specifications: 13um, 25um, 50um, 75um
  • Construction: conductor
    Material: copper, RA, ED
    Specifications: 0.5oz, 1oz, 2oz
  • Construction: substrate film
    Material: polymide film
    Specifications: 13um, 25um, 50um, 75um

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