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Tel:86-571-89901393
Fax:86-571-88680358
Email:iris@citypride.cn
Add:Suite 3-3-502, Tucuiyuan Hupan Garden,No, 176 Wenyi Xilu Hangzhou China.
Postcode:310000 |
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1. Rigid PCB capabilities
Material
· FR4 (Tg 140 to 180 ), RCC
· Rogers 4003
· BT, Polyimide
· Halogen Free Material
Treatment Type
· Hot Air Leveling (Sn/Pb) -Min. 100u"
· Hot Air Leveling (Pure Tin) - Min. 100u"
· Connect Tip Gold Plating - Max. 80u"
· Immersion Gold - Max. 8u"
· Immersion Tin - Max. 40u"
· Immersion Silver - Max. 10u"
· Immersion Nickel - Max. 250u"
· Entek - Min. 15u"
· Carbon Ink
· Peelable Solder Mask
Production Technology
· File Types: Gerber 274-X, 274 & Aperture file
· Working Panel Size: Maximum- 21" x 24" (533mm x 609mm) / Minimum- 8" x 10" (203mm x 254mm)
· Board Thickness: Maximum- 0.200" / Minimum- 0.004"
· Board Thickness Tolerance: +/-0.003"(T<0.020") , +/-0.005(0.02"< T<0.062")
· Finished Hole Size: Min. -0.008" (0.20mm)
· Aspect Ratio : 8:1
· Hole Dia Tolerance: PTH+/-0.003" / NPTH+/-0.002"
· Hole True Position: 0.005"
· Layer Count : 2 to 18 Layers
· Minimum Line Width / Spacing: 0.004' / 0.004" (for original Gerber file)
· Minimum Spacing / Edge to Conductor: 0.001"
· Copper Weight: Maximum-4oz / Minimum-1/3oz
· SMD Pitch: Min. - 0.012"
· Impedance Control: +/-10%
· Solder Dam for SMD: Min. - 0.016" pitch
· Solder Mask Clearance: Max. - 0.002"
· Layer to Layer Rigistration: Max. - 0.005"
· Warpage: Max. - 0.7%
· Electrical Testing Conditions
Voltage: Maximum : 250V
Continuity Resistance : 20 Ohm
Isolation Resistance : 20M Ohm
2. Rigid-flex/Flexible PCB capabilities
Material CCL
· Two Types of Copper: RA Copper for high frequency bending application , ED Copper for very low or one time bending application
· CCL Thickness: 0.018mm (0.72mil) Half oz / 0.036mm (1.4mil) 1 oz / 0.071mm (2.8mil) 2oz - Only for massive current
· Substrate (Kapton / Polyimide) : 0.013mm (0.5mil) / 0.025mm (1mil) / 0.051mm(2mil)
· Adhesive Thickness: 0.013mm(0.5mil ) to 0.020mm (0.8mil)
· For Rigid-Flex Material: FR-4, FR-5, Rogers, Halogen Free Material
Coverlay
· Kapton / Polyimide Thickness: 0.013mm (0.5mil) / 0.025mm (1mil) / 0.051mm (2mil)
· Adhesive Thickness : 0.013mm(0.5mil ) to 0.036mm (1.4mil)
· Coverlay rigistration tolerance: <0.1mm
Stiffener
· PI / PET / FR4 ( according to fabrication requirements)
· Thickness Tolerance : +/-0.03mm
· Dimension tolerance ; +/-0.3mm
Production Technology
· Layers: FPC- upto 10Layer / Rigid-Flex -1+N+1=8Layer
· Min. Hole size: CNC= 0.20mm(8mil) / Punching Hole = 0.5mm(20mil)
· Minimum Line Width / Spacing: 3mil / 3mil
· FPC Board Thickness: Single side = 3mil Min. / Double side = 5mil Min. / 4 Layer= 14milMin.
· Impedance Control: 100ohm (differential normal type) 50ohm(single end normal type) +/-10%
Surface Treatment Type
· Immersion Tin - Standard 0.5um to 1um (20u" - 40u")
· Immersion Gold : 2u"
· Electrolysis Gold: 20u" - 40u"
· Nickel Plating: Hard Ni- 3um (120u") / Soft Ni - 6um(240u") |
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